Driven by the boom in AI servers, GPUs, and ASICs, the global IC substrate market is projected to reach US$19.51 billion by 2026—a 32.3% year-over-year increase—with high-end ABF substrates in tight supply. As chiplets and advanced packaging reshape the supply chain, manufacturers are racing to expand capacity, pointing to sustained double-digit growth through the end of the decade.
Unimicron Technology
- Location: No. 177, Shanying Rd., Guishan District, Taoyuan City 333, Taiwan
- Company type: Electronics and semiconductor manufacturing — printed circuit boards (PCBs) and IC packaging substrates
- Year founded: 1990
- Number of employees: ~300
- Main products: ABF substrates, HDI, and rigid multilayer PCBs
- Primary focus: High-end substrates for AI accelerators, GPUs, CPUs, servers, and high-performance computing
- Official company website: https://www.unimicron.com
- Profile: The world's largest manufacturer of PCBs and IC substrates by market share, with revenues exceeding US$4 billion in 2025. It holds the leading market share in ABF substrates (~26.6%) and supplies NVIDIA, Apple, and major chipmakers, operating approximately 10 plants globally.
- Products and Business: Supplies ABF build-up substrates, HDI, and rigid PCBs for AI servers, GPUs, CPUs, telecommunications network equipment, and mobile devices.
South-Electronic
- Location: Shenzhen, Guangdong Province, China
- Company type: Electronics and ceramics manufacturing — IC packaging substrates, ceramic products, and automotive filters
- Year founded: 2010
- Number of employees: ~100
- Main products: Rigid multilayer PCBs, HDI boards, flexible and rigid-flex circuits, metal/ceramic core PCBs, plus turnkey SMT/DIP assembly
- Primary focus: High-mix, low-volume rapid prototyping and small-to-medium batch production for LED lighting, automotive power modules, industrial controls, medical devices, and IoT
- Official company website: https://southelectronicpcb.com/
- Profile: A comprehensive PCB provider based in Shenzhen serving hardware startups and small OEMs in Europe and North America. It offers prototypes with no minimum order quantity (MOQ), a 5-year warranty, and authorized component sourcing, prioritizing technical communication and long-term supply chain stability over mass production scale.
- Products and Services: Manufactures FR-4, Rogers/PTFE, flexible, and metal-core PCBs (1–64 layers) and provides turnkey SMT/DIP assembly, testing, component sourcing, and wire harness and cable integration.
Samsung Electro-Mechanics
- Location: 150 Maeyeong-ro, Yeongtong-gu, Suwon 16674, Gyeonggi-do, South Korea
- Company type: Electronic component manufacturing — passive components, camera modules, and semiconductor substrates
- Year founded: 1973
- Number of employees: ~200
- Main products: FC-BGA package substrates, MLCCs, camera modules, and communication modules
- Primary focus: FC-BGA substrates for mobile processors, memory, AI servers, and networking; supply partnership with AMD
- Official company website: https://www.samsungsem.com
- Profile: A Samsung Group subsidiary with ~US$8 billion in revenue in 2024. It is rapidly expanding ABF/FC-BGA capacity in Busan and Vietnam to meet demand for substrates for AI servers and AMD, and is a major global manufacturer of MLCCs.
- Products and businesses: Produces MLCCs, FC-BGA package substrates, camera modules, and communication modules for mobile, automotive, server, and consumer applications.
Nan Ya PCB Corporation
- Location: Kaohsiung City, Taiwan
- Company type: Electronics manufacturing — PCBs and IC packaging substrates
- Year founded: 1998
- Number of employees: ~100
- Main product: IC packaging substrates, HDI, and rigid multilayer PCBs
- Primary focus: Substrates for microprocessors, memory chips, and high-speed communication chips
- Official company website: https://pcb.npc.com.tw
- Profile: A subsidiary of Formosa Plastics Group with ~US$2.5 billion in revenue in 2025. It ranks among the world's leading manufacturers of ABF substrates (~13.5% market share), leveraging automated production and AI-driven quality control for the semiconductor and telecommunications markets.
- Products and business: Manufactures substrates for IC packaging, HDI, and multilayer PCBs for chips, smartphones, networking equipment, and automotive electronics.
Shinko Electric Industries
- Location: 80 Oshimada-machi, Nagano City, Nagano 381-2287, Japan
- Company type: Semiconductor packaging manufacturing — IC packages and precision components
- Year founded: 1946
- Number of employees: ~100
- Main products: FC-BGA/FC-CSP substrates, lead frames, IC packages, thermal solutions
- Core focus: Flip-chip packaging with high thermal dissipation and line/space capabilities below 5 μm
- Official company website: https://www.shinko.co.jp
- Profile: A Fujitsu Group company with revenues of approximately ¥215 billion, listed on the Tokyo Stock Exchange Prime Market. It is a leading supplier of high-reliability organic substrates for servers and high-end computing, known for its innovation in thermal management.
- Products and businesses: Develops and manufactures semiconductor packaging, FC-BGA/FC-CSP substrates, lead frames, and precision metalized components.
Kinsus Interconnect Technology
- Location: No. 1245 Chung Hua Rd., Xinwu District, Taoyuan City 327, Taiwan
- Company type: Electronics manufacturing — IC packaging substrates
- Year founded: 2000
- Number of employees: ~600
- Main product: Flip-chip substrates, BGA/CSP substrates, coreless and ultra-thin substrates
- Primary focus: Substrates for RF chips, baseband ICs, GPUs, and packaging for mobile and wearable devices
- Official company website: https://www.kinsus.com.tw
- Profile: A subsidiary of the Pegatron Group with ~US$1.3 billion in revenue. It specializes in coreless and ultra-thin substrates and is expanding ABF capacity for cloud computing, AI, and 5G, maintaining solid profit margins among its Taiwanese peers.
- Products and business: Produces plastic BGAs, CSPs, flip-chips, and thermally enhanced substrates for mobile, RF, automotive, and consumer packaging applications.
AT&S
- Location: Fabrikstraße 13, 8700 Leoben, Austria
- Company type: Electronics manufacturing — High-end PCBs and IC substrates
- Year founded: 1987
- Number of employees: ~500
- Main products: High-end PCBs, IC substrates, substrate-like PCBs, HDI boards
- Primary focus: Computing, data centers, AI, mobile, automotive, and medical electronics
- Official company website: https://www.ats.net
- Profile: Europe's leading manufacturer of PCBs and IC substrates, with ~€1.8 billion in revenue and plants in Austria, China, India, Malaysia, and Korea. It is one of the few European-scale competitors challenging Asian market leaders, with particular strength in miniaturization and high-frequency boards.
- Products and business: Manufactures high-end PCBs, IC substrates, and HDI boards for mobile, automotive, medical, industrial, and computing applications.
LG Innotek
- Location: E1/E3 Dong, 30 Magokjungang 10-ro, Gangseo-gu, Seoul 07796, South Korea
- Company type: Electronic component manufacturing — optics, packaging substrates, and materials
- Year founded: August 22, 1970
- Number of employees: ~300
- Main products: Camera modules, 3D sensing modules, FC-CSP/packaging substrates, tape substrates, photomasks
- Key focus: Mobile and automotive camera modules, FC-BGA substrates, robot vision, and XR sensing
- Official company website: https://www.lginnotek.com
- Profile: The world's leading supplier of smartphone camera modules, with ~US$15.4 billion in revenue in 2024. It is expanding into automotive cameras, vision systems for humanoid robots, and high-value FC-BGA substrates, targeting US$2.2 billion in substrate revenue by 2030.
- Products and business: Produces camera/3D sensing modules, packaging substrates, tape substrates, and photomasks for mobile, automotive, IoT, and semiconductor applications.
Simmtech
- Location: 73 Sandan-ro, Heungdeok-gu, Cheongju-si, Chungcheongbuk-do, South Korea
- Company type: Electronics manufacturing — PCBs and semiconductor packaging substrates
- Year founded: 1987
- Number of employees: ~200
- Main product: PCBs for memory modules, BGA substrates, high-layer-count PCBs for semiconductors
- Primary focus: Substrates for DRAM/NAND memory, HBM packaging, and mobile application processors
- Official company website: https://www.simmtech.net
- Profile: Holds the largest global market share for PCBs used in DRAM modules and BOC substrates, with close integration into the Korean memory ecosystem. It is expanding into HBM and logic substrates, with manufacturing plants in Cheongju and Xi’an.
- Products and business: Manufactures high-layer-count PCBs for semiconductors, substrates for memory modules, and BGA package substrates for DRAM, NAND, and mobile AP packaging.
Kyocera
- Location: 6 Takeda Tobadono-cho, Fushimi-ku, Kyoto 612-8501, Japan
- Company type: Ceramics and electronics manufacturing — semiconductor packages, components, and industrial products
- Year founded: 1959
- Number of employees: ~200
- Main products: Ceramic IC packages and substrates, organic packages, semiconductor components, crystal devices
- Primary focus: Ceramic and organic packages for automotive, industrial, aerospace, and high-reliability semiconductor applications
- Official company website: https://global.kyocera.com
- Profile: Founded by Kazuo Inamori, Kyocera is a global leader in ceramic packaging, with revenues of approximately US$13.5 billion in 2025. It is a pioneer in aluminum nitride and silicon nitride substrates for SiC/GaN power devices used in electric vehicles, aerospace, and defense applications.
- Products and Business: The company manufactures ceramic and organic IC packages, semiconductor components, optical devices, and electronic materials for the automotive, industrial, and communications markets.
If you are looking for a reliable PCB partner amidst the boom in AI servers and advanced packaging, look no further than South-Electronic. From rapid-turnaround prototypes to high-volume SMT assembly, we offer FR-4, Rogers, flexible, and metal-core PCBs, backed by strict quality control and flexible terms with no minimum order quantity (MOQ). Contact us at inquiry@southelectronicpcb.com to discuss your project today.
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