FOR HIGH-MIX, LOW-VOLUME ELECTRONICS PROJECTS
Turnkey
PCB Assembly Service
From Prototype to Small & Medium Batch Production
We specialize in high-mix, low-volume turnkey PCB assembly for hardware startups and small OEM manufacturers.
Built for Hardware Teams Who Need
More Than Just PCB Assembly
From prototype to stable small-batch production — with sourcing, DFM and quality control built-in.
High-Mix, No MOQ Flexibility
- 1–64 layers supported
- DFM feedback in 24–48h
- No strict MOQ
Reliable & Cost-Optimized BOM Sourcing
- 100% genuine components
- Global sourcing network
- Full lot/date code traceability
Direct Engineer-to-Engineer Support
- Dedicated project engineer
- DFM feedback within 24–48h
- Technical review before mass production
Scalable from Prototype to 10K Units
- 5 pcs – 10,000 pcs supported
- Consistent quality across repeat orders
- Flexible production scheduling
What we offer
What we can build for ourselves
• 1–64 Layer Multilayer FR4 PCB
• HDI & High-TG PCB
• Impedance Control & Stack-up Support
• Rogers & PTFE Laminates
• Controlled Impedance for RF Applications
• Low-Loss Materials for Signal Integrity
• Flex & Rigid-Flex Structures
• Ceramic & Metal Core PCB
• Thick Copper & Backplane Designs
• Global component sourcing
• Full BOM traceability (lot/date code)
• DFM review before production
• Fine-pitch & BGA placement
• Mixed technology assembly
• AOI, X-ray & functional testing
• Cable & enclosure integration
• System-level assembly
• Packaging & logistics support
Industries We Serve
PCB & PCBA for Industry Applications
• Control boards
• Power modules
• Automation systems
• Wireless modules
• Consumer smart hardware
• Rapid prototyping
• Control units
• LED modules
• Automotive-grade assembly
• Diagnostic boards
• Low-volume precision builds
• Traceability support
Proven Experience in Complex PCB & PCBA Projects
High-Mix Industrial Control Boards
• 6–8 layer FR4 PCB
• Mixed SMT & THT assembly
• Batch size: 200–1,000 units
Automotive Electronic Modules
• 8–10 layer impedance PCB
• Automotive-grade components
• Full lot/date code traceability
Medical & Precision Devices
• Low-volume precision builds
• Fine-pitch BGA placement
• Functional testing included
Quality Control Process
A controlled workflow for stable production — with inspection records and traceability.
Incoming Inspection
Reduce wrong parts & counterfeit risks before production.
- IQC for key components (visual, marking, package check)
- PCB appearance + dimensional checks
- BOM/AVL alignment before kitting
Solder Paste Inspection (SPI)
Catch paste volume/offset issues early to prevent rework later.
- Paste volume monitoring & trend control
- Stencil alignment validation
- Process window checks at start-up
In-Process AOI
Detect placement & solder defects fast — with immediate feedback loop.
- Real-time visual inspection on SMT lines
- Immediate defect feedback for process correction
- Coverage per project requirements
X-Ray Inspection (as needed)
Verify hidden joints on BGA/QFN to reduce field failures.
- BGA/QFN hidden solder joint verification
- Void analysis & solder integrity review
- Used when design/package requires
ICT / Functional Test
Confirm electrical performance before shipment — not after you receive it.
- ICT for opens/shorts & key nets (when applicable)
- Functional verification under defined load/conditions
- Test plan aligned to your requirements
Final Inspection & Packing
Ship with documented results and ESD-safe packing for transit reliability.
- Final QC check + packaging control
- ESD-safe materials and labeling
- Shipment documentation aligned with your request
Our CERTIFICATEs
Certified Excellence, Ensuring Your Trust.
Why Us?
Technical Insights & Engineering Resources
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