FOR HIGH-MIX, LOW-VOLUME ELECTRONICS PROJECTS
Turnkey
PCB Assembly
From Prototype to Small & Medium Batch Production
We specialize in high-mix, low-volume turnkey PCB assembly for hardware startups and small OEM manufacturers.
Built for Hardware Teams Who Need
More Than Just PCB Assembly
From prototype to stable small-batch production — with sourcing, DFM and quality control built-in.
High-Mix, No MOQ Flexibility
- 1–64 layers supported
- DFM feedback in 24–48h
- No strict MOQ
Reliable & Cost-Optimized BOM Sourcing
- 100% genuine components
- Global sourcing network
- Full lot/date code traceability
Direct Engineer-to-Engineer Support
- Dedicated project engineer
- DFM feedback within 24–48h
- Technical review before mass production
Scalable from Prototype to 10K Units
- 5 pcs – 10,000 pcs supported
- Consistent quality across repeat orders
- Flexible production scheduling
What we offer
What We Can Build for You
• 1–64 Layer Multilayer FR4 PCB
• HDI & High-TG PCB
• Impedance Control & Stack-up Support
• Rogers & PTFE Laminates
• Controlled Impedance for RF Applications
• Low-Loss Materials for Signal Integrity
• Flex & Rigid-Flex Structures
• Ceramic & Metal Core PCB
• Thick Copper & Backplane Designs
• Global component sourcing
• Full BOM traceability (lot/date code)
• DFM review before production
• Fine-pitch & BGA placement
• Mixed technology assembly
• AOI, X-ray & functional testing
• Cable & enclosure integration
• System-level assembly
• Packaging & logistics support
Industries We Serve
PCB & PCBA for Industry Applications
• Control boards
• Power modules
• Automation systems
• Wireless modules
• Consumer smart hardware
• Rapid prototyping
• Control units
• LED modules
• Automotive-grade assembly
• Diagnostic boards
• Low-volume precision builds
• Traceability support
Proven Experience in Complex PCB & PCBA Projects
High-Mix Industrial Control Boards
• 6–8 layer FR4 PCB
• Mixed SMT & THT assembly
• Batch size: 200–1,000 units
Automotive Electronic Modules
• 8–10 layer impedance PCB
• Automotive-grade components
• Full lot/date code traceability
Medical & Precision Devices
• Low-volume precision builds
• Fine-pitch BGA placement
• Functional testing included
Quality Control Process
Incoming Quality Control
• Component verification against approved AVL
• PCB dimensional & stack-up inspection
Solder Paste Inspection
• Paste volume monitoring
• Stencil alignment validation
In-line AOI
• Real-time placement inspection
• Immediate defect feedback loop
X-Ray Inspection
• BGA, QFN and hidden solder joint verification
• Void analysis and solder integrity evaluation
ICT / Functional Test
• Functional verification under defined load conditions
• Programming, calibration and firmware loading supported
Final Inspection & Packing
• ESD-safe packaging and labeling control
• Shipment documentation aligned with customer requirements
Our CERTIFICATEs
Certified Excellence, Ensuring Your Trust.
Why Us?
Technical Insights & Engineering Resources
What are the different types of solder mask materials?
Discover the main types of solder mask (epoxy, LPI, dry film) and their unique applications, ensuring optimal PCB performance.
What are important considerations for BGA fanout design?
Struggling with complex BGA routing? Many engineers face this challenge. Without proper fanout, your high-performance designs can hit a roadblock. BGA fanout1 is how we
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