FOR HIGH-MIX, LOW-VOLUME ELECTRONICS PROJECTS
Turnkey
PCB Assembly
From Prototype to Small & Medium Batch Production
We specialize in high-mix, low-volume turnkey PCB assembly for hardware startups and small OEM manufacturers.
Built for Hardware Teams Who Need More Than Just PCB Assembly
• 1–64 layers supported
• 24–48h DFM feedback
• No strict MOQ
• 100% genuine components
• Global sourcing network
• Full lot/date code traceability
• Dedicated project engineer
• DFM feedback within 24–48h
• Technical review before mass production
• 5 pcs – 10,000 pcs supported
• Consistent quality across repeat orders
• Flexible production scheduling
What we offer
What We Can Build for You
• 1–64 Layer Multilayer FR4 PCB
• HDI & High-TG PCB
• Impedance Control & Stack-up Support
• Rogers & PTFE Laminates
• Controlled Impedance for RF Applications
• Low-Loss Materials for Signal Integrity
• Flex & Rigid-Flex Structures
• Ceramic & Metal Core PCB
• Thick Copper & Backplane Designs
• Global component sourcing
• Full BOM traceability (lot/date code)
• DFM review before production
• Fine-pitch & BGA placement
• Mixed technology assembly
• AOI, X-ray & functional testing
• Cable & enclosure integration
• System-level assembly
• Packaging & logistics support
Industries We Serve
PCB & PCBA for Industry Applications
• Control boards
• Power modules
• Automation systems
• Wireless modules
• Consumer smart hardware
• Rapid prototyping
• Control units
• LED modules
• Automotive-grade assembly
• Diagnostic boards
• Low-volume precision builds
• Traceability support
Proven Experience in Complex PCB & PCBA Projects
High-Mix Industrial Control Boards
• 6–8 layer FR4 PCB
• Mixed SMT & THT assembly
• Batch size: 200–1,000 units
Automotive Electronic Modules
• 8–10 layer impedance PCB
• Automotive-grade components
• Full lot/date code traceability
Medical & Precision Devices
• Low-volume precision builds
• Fine-pitch BGA placement
• Functional testing included
Quality Control Process
Incoming Quality Control
• Component verification against approved AVL
• PCB dimensional & stack-up inspection
Solder Paste Inspection
• Paste volume monitoring
• Stencil alignment validation
In-line AOI
• Real-time placement inspection
• Immediate defect feedback loop
X-Ray Inspection
• BGA, QFN and hidden solder joint verification
• Void analysis and solder integrity evaluation
ICT / Functional Test
• Functional verification under defined load conditions
• Programming, calibration and firmware loading supported
Final Inspection & Packing
• ESD-safe packaging and labeling control
• Shipment documentation aligned with customer requirements
Our CERTIFICATEs
Certified Excellence, Ensuring Your Trust.
Why Us?
Technical Insights & Engineering Resources
What are important considerations for BGA fanout design?
Struggling with complex BGA routing? Many engineers face this challenge. Without proper fanout, your high-performance designs can hit a roadblock. BGA fanout1 is how we
What is via filling?
Via filling improves PCB reliability by fully filling plated through-holes, preventing issues like air/moisture entrapment.
Start Your PCBA Project
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