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BGA Packages

BGA packaging combines efficiency with complexity. They meet the urgent needs of modern electronics for miniaturization, enhanced performance and reliability. As technology continues to evolve, BGA packaging will undoubtedly continue to adapt, maintaining its critical role in driving innovation and meeting the growing demands of electronic devices and systems.

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Factory Address

Industrial Park, No. 438, Shajing Donghuan Road, Bao'an District, Shenzhen, Guangdong, China

Head Office Address

Floor 4, Zhihui Creative Building, No.2005 Xihuan Road, Shajing, Baoan District, Shenzhen, China

HK Office Address

ROOM A1-13,FLOOR 3,YEE LIM INDUSTRIAL CENTRE 2-28 KWAI LOK STREET, KWAI CHUNG HK,CHINA

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Phone : +86 400 878 3488

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Microchip Removal