PCB Boards
Rigid PCB Process Capability
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Layer Count
1-68 layers
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PCB Dimensions
≤24*48inch(610*1220mm)
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Materials Types
FR-4 ｜ High Tg ｜ Halogen-free ｜ PTFE ｜ Ceramic PCB ｜ Metal substrate material
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Material Brand
Lianmao｜Shengyi｜ Taiyao｜ Nanya, Panasonic｜Isola｜Nelco｜Rogers｜Taconic｜Arlon...
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Board Thickness
0.2mm-8.0mm
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Finish Treatment
Immersion Gold｜Lead-free HASL｜OSP｜Immersion Tin｜Immersion Silver｜Thick Gold Plating｜Silver Plating｜Immersion Gold+OSP
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Copper thickness
0.33 OZ-8 OZ
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SolderMask Color
Green｜ Blue｜ Black｜Yellow｜ Red｜Purple｜ White...
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Finish Treatment
Immersion Gold｜Lead-free HASL｜OSP｜Immersion Tin｜Immersion Silver｜Thick Gold Plating｜Silver Plating｜Immersion Gold+OSP
Flex PCB Process Capability
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Layer Count
1-8 layers
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PCB Dimensions
≤9*14inch（230*355mm）
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Board Thickness
0.05mm-0.8mm
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Finish Treatment
Lead HASL｜Immersion gold｜ Chemical nickel palladium gold｜Soft gold plating｜ Hard gold plating｜Immersion silver｜OSP,｜Immersion tin｜ENIG+OSP｜ ENIG+G/F
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Copper Thickness
≤3 OZ
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SolderMask Color
Green｜ Blue｜ Black｜Yellow｜ Red｜Purple｜ White...
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Finish Treatment
Immersion Gold｜Lead-free HASL｜OSP｜Immersion Tin｜Immersion Silver｜Thick Gold Plating｜Silver Plating｜Immersion Gold+OSP
Rigid-Flex PCB Process Capability
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Layer Count
Rigid:2-20 layers + Flex: 1-8 layers
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Board Thickness
10*15mm≤X≤ 16inch*29inch（406*736mm）
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Finish Treatment
Lead HASL｜Immersion gold｜ Chemical nickel palladium gold｜Soft gold plating｜ Hard gold plating｜Immersion silver｜OSP,｜Immersion tin｜ENIG+OSP｜ ENIG+G/F
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Copper Thickness
≤3 OZ
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SolderMask Color
Green｜ Blue｜ Black｜Yellow｜ Red｜Purple｜ White...
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Finish Treatment
Immersion Gold｜Lead-free HASL｜OSP｜Immersion Tin｜Immersion Silver｜Thick Gold Plating｜Silver Plating｜Immersion Gold+OSP
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Rigid PCB Material Brand
ITEQ IT-180A｜Isola FR408HR｜Shengyi S1000-2｜Nanya N4000-13｜Panasonic Megtron 6｜Ventec VT-47｜TUC TU-872 SLK｜Rogers RO4350B｜Arlon 85N｜Kingboard KB-6160...
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Flex PCB Material Brand
DuPont Pyralux AP｜Panasonic FELIOS｜Nippon Steel Chemical PYRALUX FR｜Taiflex TA-72｜Shengyi SF305...
PCB Assembly Process Capability
