Custom 8-Layer PCB Manufacturing Services
Min trace 3/3 mil | ENIG / HASL | FR-4 & High-TG | AOI & E-Test
We manufacture high-precision 8-layer PCBs for industrial, IoT, and power electronics, with stable quality and consistent performance for repeat production.
8-Layer PCB Capabilities
Rigid PCB Process Capability
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Layer Count
8 layers
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PCB Dimensions
≤24*48inch(610*1220mm)
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Materials Types
FR-4 ｜ High Tg ｜ Halogen-free ｜ PTFE ｜ Ceramic PCB ｜ Metal substrate material
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Material Brand
Lianmao｜Shengyi｜ Taiyao｜ Nanya, Panasonic｜Isola｜Nelco｜Rogers｜Taconic｜Arlon...
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Board Thickness
0.2mm-8.0mm
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Finish Treatment
Immersion Gold｜Lead-free HASL｜OSP｜Immersion Tin｜Immersion Silver｜Thick Gold Plating｜Silver Plating｜Immersion Gold+OSP
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Copper thickness
0.33 OZ-8 OZ
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SolderMask Color
Green｜ Blue｜ Black｜Yellow｜ Red｜Purple｜ White...
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Finish Treatment
Immersion Gold｜Lead-free HASL｜OSP｜Immersion Tin｜Immersion Silver｜Thick Gold Plating｜Silver Plating｜Immersion Gold+OSP
Why Choose Us for 8-Layer PCB Manufacturing
We support engineers with reliable 8-layer PCB manufacturing,
from prototype builds to stable repeat production.
Every 8-layer PCB is reviewed by our engineers to verify stack-up, impedance control, and manufacturability before production.
We focus on consistent quality across batches, supporting both prototypes and long-term production.
Experienced in tight trace/space, controlled impedance, and multilayer lamination for complex designs.
Clear technical communication and fast response to support overseas engineering and purchasing teams.
Related Project We Had Done
8-Layer PCB for Industrial Control System
Application
Industrial Control
Key Specs
8-layer, controlled impedance
Challenge
Dense layout & signal integrity
Result
Stable performance in mass production
8-Layer PCB for Industrial Power Control
Application
Industrial Power Control
Key Specs
8-layer, heavy copper, controlled impedance
Challenge
High current handling with thermal management requirements
Result
Reliable operation under continuous load in mass production
8-Layer PCB for IoT Gateway Device
Application
IoT Gateway & Communication Device
Key Specs
8-layer, HDI structure, impedance controlled
Challenge
High-density layout with signal integrity for high-speed interfaces
Result
Stable signal performance and consistent quality across batches
Quality Control & Certifications for 8-Layer PCB Production
Common Questions
Most Popular Questions
What is the typical lead time for 8-layer PCB production?
Prototype lead time is typically 7–10 working days.
Mass production lead time depends on quantity and specifications.
Do you support controlled impedance for 8-layer PCBs?
Yes. We support impedance control and provide stack-up review and impedance calculation before production.
What materials are available for 8-layer PCBs?
Common materials include FR-4, High-TG FR-4, and other special materials upon request.
What quality control processes are applied to 8-layer PCBs?
All 8-layer PCBs undergo AOI inspection, electrical testing (E-Test), and process control throughout production.
What files are required to get an 8-layer PCB quotation?
Please provide Gerber files, PCB quantity, and any special requirements such as impedance control or material preference.
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