Checklist in PCB design~

CONTENTS

🔧 Data Input Stage Checklist!

  • 📋 Document Completeness: Are schematics, *.brd files, BOM, design specs, etc., all received?
  • ⏱️ Template Currency: Confirm the PCB template[^1] is the latest version—old templates cause issues!
  • Clock Device Layout: Check if clock components are placed rationally to avoid signal interference
  • 📌 Positioning Devices: Verify positioning device coordinates in the template are 100% accurate
  • 📝 Design Requirement Clarity: Ensure design notes, modification requests, and standards are unambiguous
  • 🚫 Prohibited Zones: Confirm forbidden placement/routing areas on the outline are mirrored in the template
  • 📏 Dimensions & Holes: PCB dimensions, tolerances, and metalized hole definitions must be precise
  • 🔒 Template Locking: Lock the structure file after verification to prevent accidental edits

🔍 Post-Layout Inspection: 6 Core Dimensions!

🌟 Component Inspection Essentials

  • Package Consistency: All component packages must match the company library—use viewlog for updates
  • 🔄 Board Interfaces: Ensure signal/position correspondence between mother/daughterboards; correct connector orientation with anti-misinsertion designs
  • 🧩 100% Placement: Confirm all components are placed—no stragglers!
  • 🛑 Overlap DRC Check: Enable TOP/BOTTOM place-bound layers to scan for DRC issues from overlaps
  • 🎯 Mark Points: Mark points must be sufficient for production positioning
  • ⚖️ Heavy Component Placement: Position heavy components near PCB supports to minimize warping
  • 🔒 Structure-Locked Components: Lock structure-related components after layout to prevent displacement

📡 Functional & Signal Integrity Checks

  • 📊 Analog/Digital Partitioning: Separate analog/digital circuits on mixed boards with rational signal flow
  • High-Speed Layout[^2]: Clock/high-speed devices and termination resistors must follow SI guidelines
  • 🔗 Reference Plane Treatment: Coupling capacitors for cross-plane signals should be near routing areas
  • ⚙️ Decoupling Capacitors: Quantity and placement of IC decoupling caps directly impact signal stability
  • 🛡️ EMC Component Placement: EMC-sensitive parts[^3] like reset circuits must follow design guidelines

🔥 Thermal & Power Planning

  • 🌡️ Heat-Sensitive Components: Crystals, liquid caps, etc., should stay away from high-power heat sources
  • 🔋 Power Path Optimization: IC power supplies must not be too distant; rational LDO/module power layouts

📡 Post-Routing Final Verification: 10 Critical Modules!

⚡ High-Speed & Analog/Digital Routing

  • 📶 Impedance Consistency: Maintain uniform impedance for high-speed traces; differential pairs need length matching/symmetry
  • ⏱️ Clock Trace Handling: Route clock lines on inner layers; avoid via-dense areas
  • 🔢 Analog/Digital Separation: A/D converters straddle partitions; signals don’t cross split zones

High-Speed ​​PCB Routing

🛡️ EMC & Reliability Design

  • 🧲 Crystal Protection: Place ground planes under crystals; no traces through component pins
  • ⚠️ Routing Taboos: Avoid acute/right angles; adjacent layer signals should route perpendicularly
  • 🌐 Ground Plane Treatment: Power/ground planes free of islands/cracks; add shielding vias at splits

🔌 Power/Ground & Process Details

  • Current Carrying Capacity: Power/ground via count must meet current requirements (1A/mm trace width reference)
  • 📏 Prohibited Areas: No traces near metal components/mounting holes; non-metalized hole clearances must comply
  • 🖨️ Silkscreen & Coding: Correct component designators/polarity marks; PCB codes in company-standard positions

🧰 Process & Production Readiness

  • 🔍 DRC Zero Plan: Enable constraints to scan DRC errors—resolve all critical issues
  • 🎯 Optical Alignment Marks: SMT-side marks avoid traces; add marks near BGA components
  • 📦 File Completeness: Gerbers, drill files, SMT coordinates, etc., must be complete with standardized naming

📢 Conclusion: 3 Keys to PCB Design Success!

From data input to routing completion, PCB reliability hinges on systematic inspection processes, detail-oriented control, and cross-stage verification awareness. Overlooking any step risks mass-production issues—internalizing this checklist as design habits is key to high-performance, reliable PCBs!


[^1]: Understanding the significance of the latest PCB templates can help prevent design issues and ensure optimal performance.
[^2]: Exploring high-speed layout techniques can enhance your PCB design, ensuring better signal integrity and performance.
[^3]: Learning about EMC-sensitive part placement can significantly improve your PCB's reliability and compliance with standards.

Share it :

Send Us A Message

The more detailed you fill out, the faster we can move to the next step.

Get in touch

Where Are We?

Factory Address

Industrial Park, No. 438, Shajing Donghuan Road, Bao'an District, Shenzhen, Guangdong, China

Head Office Address

Floor 4, Zhihui Creative Building, No.2005 Xihuan Road, Shajing, Baoan District, Shenzhen, China

HK Office Address

ROOM A1-13,FLOOR 3,YEE LIM INDUSTRIAL CENTRE 2-28 KWAI LOK STREET, KWAI CHUNG HK,CHINA

Let's Talk

Phone : +86 400 878 3488

Send Us A Message

The more detailed you fill out, the faster we can move to the next step.

Microchip Removal