+86 4008783488

20240617-151702

PCB Surface Treatment

CONTENTS

Introduction:

In the complex realm of electronics, while processors, memory chips, and displays often steal the limelight, the unsung hero is the Printed Circuit Board (PCB). An integral component, the PCB’s resilience primarily hinges on its surface treatment or finish. This protective “armor” is pivotal for a device’s performance, longevity, and reliability. Delve deeper into the pivotal world of PCB finishes.

The Significance of Surface Treatments

Think of surface treatments as the protective cloak for PCBs. Their main jobs are:

  • Protection:  Defending the inherent copper from environmental adversaries like oxidation that could compromise performance or instigate board malfunctions.
  • Solderability: Augmenting solder’s adherence capability, guaranteeing robust and consistent connections.
  • Conductivity: Enhancing electrical current propagation for peak device performance.

Overview of Prevalent PCB Surface Treatments

  • HASL (Hot Air Solder Leveling):A revered, budget-friendly technique, HASL submerges the PCB into molten solder. Subsequent leveling with hot air knives eliminates superfluous solder. While cost-efficient with a proven history, it might not be ideal for ultra-fine-pitch components due to possible surface irregularities.
  •  ENIG (Electroless Nickel Immersion Gold): ENIG constitutes a dual-layered coating: a nickel barrier crowned by a gold layer. While the gold guards the nickel during storage, nickel offers a durable solderable surface. Ideal for fine-pitch components, ENIG’s precision comes at a higher price point than HASL.
  • OSP (Organic Solderability Preservative):This entails applying an organic layer over raw copper. OSP offers environmental benefits with a smooth finish but may lack the resilience of alternative methods for certain assembly processes.
  • Immersion Silver and Immersion Tin:Both immersion techniques infuse a layer of silver or tin onto the PCB copper. These offer smooth surfaces, advantageous for state-of-the-art components, yet are vulnerable to certain environmental conditions.
  • Hard  Gold:Predominantly for edge connectors, this gold finish excels in durability, apt for applications necessitating repeated physical interactions. Its premium attributes, however, come at a steeper cost.

Selection Criteria for the Ideal Surface

  • Operational Environment: For PCBs destined for stringent conditions, protective finishes like ENIG are optimal.
  • Component Density: Dense boards necessitating flat finishes might benefit from methods like ENIG or immersion techniques.
  • Budgetary Constraints: Premium finishes like hard gold, while superior, can strain budgets. In such scenarios, tried-and-true alternatives like HASL are viable.
  • Longevity and Storage: For prolonged storage, tarnish-resistant finishes (e.g., ENIG) are more adept.

The Horizon of PCB Finishes

With the relentless march of technology and the surge in wearables and medical micro-devices, PCB finishes face novel challenges. Concurrently, the industry’s ecological consciousness hints at emerging environmentally-friendly finishes.

Conclusion

In the grand arena of electronics manufacturing, PCB surface treatment may seem like just a tiny detail. Still, it’s the little things that make sure our devices work seamlessly day in and day out. So the next time you swipe your phone or watch your favorite show, think of this unsung hero and his shining armor!

Share it :

Send Us A Message

The more detailed you fill out, the faster we can move to the next step.

Get in touch

Where Are We?

Factory Address

Industrial Park, No. 438, Shajing Donghuan Road, Bao'an District, Shenzhen, Guangdong, China

Head Office Address

Floor 4, Zhihui Creative Building, No.2005 Xihuan Road, Shajing, Baoan District, Shenzhen, China

HK Office Address

ROOM A1-13,FLOOR 3,YEE LIM INDUSTRIAL CENTRE 2-28 KWAI LOK STREET, KWAI CHUNG HK,CHINA

Let's Talk

Phone : +86 400 878 3488

Send Us A Message

The more detailed you fill out, the faster we can move to the next step.

Microchip Removal