How to Reflow a Two-Sided PCB?
To reflow a double-sided PCB, you need to put solder paste and components on one side first, then reflow it. After the first side cools down, flip the board, repeat the process on the other side, and reflow it again. This sequential reflow process ensures that components on both sides are properly soldered without disturbing the already soldered parts.
How to Reflow a Board Twice?
When reflowing a double-sided PCB, secondary reflow is a critical step. Here are the steps to follow:
- First Reflow: Solder the first side of the PCB.
- Cooling: Allow the board to cool down to room temperature.
- Flip and Reapply Solder Paste: Flip the board and apply solder paste on the other side.
- Place Components: Carefully place the components on the second side.
- Second Reflow: Reflow the second side, ensuring not to disturb the components on the first side.
Step-by-Step Guide to Reflow Soldering a PCB
- Applying Solder Paste：The first step in reflow soldering is applying solder paste to the pads where components will be placed. This can be done using a stencil to ensure precise application.
- Applying Solder Paste：The first step in reflow soldering is applying solder paste to the pads where components will be placed. This can be done using a stencil to ensure precise application.
- Preheating：Preheating the PCB is essential to avoid thermal shock to the components and the board. Gradually bring the board to the required temperature before reflow.
- Thermal Soak：During the thermal soak phase, the board is held at a specific temperature to ensure the solder paste is activated and ready for reflow.
- Reflow：The reflow phase is where the solder paste melts and creates electrical connections between the components and the PCB pads. This is typically done in a reflow oven.
Reflow Temperature Profile:
| Phase | Temperature Range (°C) | Duration (seconds) |
|---|---|---|
| Preheat | 150 – 180 | 60 – 120 |
| Thermal Soak | 180 – 200 | 90 – 120 |
| Reflow | 200 – 250 | 30 – 60 |
| Cooling | 30 – 150 | 90 – 120 |
Common Issues and Solutions
| Issue | Cause | Solution |
|---|---|---|
| Component Shifting | Uneven heating, vibration | Ensure even heating, stabilize the board |
| PCB Warpage | High temperature, uneven cooling | Gradual preheating and cooling |
| Poor Solder Joints | Inadequate solder paste application | Use proper stencil and application method |
| Component Misplacement | Incorrect component placement during assembly | Use pick-and-place machine or precise manual placement |
Reflow soldering a two-sided PCB requires careful planning and execution. By following the steps outlined in this guide, you can achieve reliable and high-quality results. Whether you’re working on a high-volume production run or a low-cost prototype, these best practices will help you succeed.
