Nueva actualización de la tecnología de OSP en 2025

Los recubrimientos de OSP de 2025 ofrecen estabilidad térmica de 320°C, sobreviven a 3+ reflujo, reducen costos en comparación con ENIG/HASL y permiten la fabricación de PCB compatible con la Industria 4.0.

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Where Are We?

Factory Address

Industrial Park, No. 438, Shajing Donghuan Road, Bao'an District, Shenzhen, Guangdong, China

Head Office Address

Floor 4, Zhihui Creative Building, No.2005 Xihuan Road, Shajing, Baoan District, Shenzhen, China

HK Office Address

ROOM A1-13,FLOOR 3,YEE LIM INDUSTRIAL CENTRE 2-28 KWAI LOK STREET, KWAI CHUNG HK,CHINA

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Phone : +86 400 878 3488

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Microchip Removal