Qu’est-ce qu’un package BGA ?

Les packages BGA permettent une électronique compacte et haute performance via des matrices de billes de soudure denses. Clé pour les conceptions de cartes de circuit modernes dans les smartphones, l’automobile, l’IoT et l’aérospatiale.

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Where Are We?

Factory Address

Industrial Park, No. 438, Shajing Donghuan Road, Bao'an District, Shenzhen, Guangdong, China

Head Office Address

Floor 4, Zhihui Creative Building, No.2005 Xihuan Road, Shajing, Baoan District, Shenzhen, China

HK Office Address

ROOM A1-13,FLOOR 3,YEE LIM INDUSTRIAL CENTRE 2-28 KWAI LOK STREET, KWAI CHUNG HK,CHINA

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Phone : +86 400 878 3488

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Microchip Removal