Where are BGAs used most?

Prevent PCB overheating: choose heatsinks by material/geometry, Optimize SMT stencil thickness (0.1-0.2mm), design apertures to prevent bridges, apply coatings for fine-pitch components, and maintain stencils to extend lifespan for flawless solder paste deposition.

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Where Are We?

Factory Address

Industrial Park, No. 438, Shajing Donghuan Road, Bao'an District, Shenzhen, Guangdong, China

Head Office Address

Floor 4, Zhihui Creative Building, No.2005 Xihuan Road, Shajing, Baoan District, Shenzhen, China

HK Office Address

ROOM A1-13,FLOOR 3,YEE LIM INDUSTRIAL CENTRE 2-28 KWAI LOK STREET, KWAI CHUNG HK,CHINA

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Phone : +86 400 878 3488

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Microchip Removal