Article & Blog

Rogers, Isola, or Panasonic laminates outperform FR-4 for GHz circuits. Learn high-speed vs RF PCB differences, 5G signal loss fixes & best surface finishes for

Unlock faster circuit diagnostics with probe testing. Compare flying probe vs. ICT methods, top systems (SPEA, Keysight), and optimize workflow duration for lower costs.

Prevent PCB overheating: choose heatsinks by material/geometry, Optimize SMT stencil thickness (0.1-0.2mm), design apertures to prevent bridges, apply coatings for fine-pitch components, and maintain stencils

Choose the right PCB surface finish to avoid solder failures: HASL for low-cost prototypes, OSP for quick assembly, ENIG/ENEPIG for RF/high-reliability. Balance cost, signal needs,

Medical PCB lives depend on IPC Class 3, ISO 13485 & FDA compliance. Prevent failures: learn material requirements, cleanroom protocols & vital supplier certifications for

PCB copper thickness guide: 1 oz standard balances cost/performance. Use 2 oz for high-current/high-heat design zones. Avoid thick copper for high-frequency/sensitive price projects.

Master PCB via selection: balance cost, density & signal needs. Proper sizing prevents overheating. Understand via-pad differences. Prevent failures with plating standards.

FR-4 supports MHz designs affordably but suffers dielectric losses >5GHz/long traces. Optimize layer stackup, thermal design & shielding – or switch to low-loss laminates for

Choose IC packages by balancing signal speed, heat dissipation, board space, and cost. Avoid overheating and failures—learn key uses for BGA, QFN, QFP & SOT

Cold solder joints cause device failure. Learn to spot dull/cracked joints, fix with proper reflow and tools like flux, and test using thermal/multimeter methods.