Article & Blog

Choose the right PCB surface finish to avoid solder failures: HASL for low-cost prototypes, OSP for quick assembly, ENIG/ENEPIG for RF/high-reliability. Balance cost, signal needs,

Medical PCB lives depend on IPC Class 3, ISO 13485 & FDA compliance. Prevent failures: learn material requirements, cleanroom protocols & vital supplier certifications for

PCB copper thickness guide: 1 oz standard balances cost/performance. Use 2 oz for high-current/high-heat design zones. Avoid thick copper for high-frequency/sensitive price projects.

Master PCB via selection: balance cost, density & signal needs. Proper sizing prevents overheating. Understand via-pad differences. Prevent failures with plating standards.

FR-4 supports MHz designs affordably but suffers dielectric losses >5GHz/long traces. Optimize layer stackup, thermal design & shielding – or switch to low-loss laminates for

Choose IC packages by balancing signal speed, heat dissipation, board space, and cost. Avoid overheating and failures—learn key uses for BGA, QFN, QFP & SOT

Cold solder joints cause device failure. Learn to spot dull/cracked joints, fix with proper reflow and tools like flux, and test using thermal/multimeter methods.

Rigid flex PCBs merge solid & bendable circuits to eliminate connectors, cut failure risks, boost signal integrity, and enable compact designs for medical/aerospace systems.

FR4 PCB material dominates with 5 key traits: insulation, strength, flame retardancy (UL-certified), moisture resistance, and cost-efficiency. Avoid catastrophic failures by mastering specs.

Optimize standard PCB panel sizes (18×24″, 12×18″) to cut costs. Choose breakaway methods wisely, minimize material waste, and avoid design errors to maximize yield and