Article & Blog

Arlon PCB materials excel in high-frequency signals, thermal endurance & cost-efficiency for aerospace, telecom, and RF applications over FR-4/Rogers.

Taconic PCBs: PTFE-ceramic materials for RF/high-frequency apps, low loss & thermal stability in 5G, aerospace radar, satellites.

Transparent PCBs use glass/polyimide for see-through circuits, enabling futuristic wearables, medical devices, and displays while balancing clarity/functionality.

Burn-in boards stress-test semiconductors to ensure reliability, prevent premature failures, and meet auto/medical industry standards.

Master smartphone PCB design: HDI layering, thermal vias, signal shielding, military testing for reliability in compact devices.

Solder reflow requires precise thermal profiles (preheat, soak, reflow, cooling) with 2-5°C/s ramp rates, 215±5°C peak, and controlled cooling to ensure defect-free metallurgical bonding.

ENIG vs gold plating: ENIG excels in complex/high-frequency PCBs, gold plating for durability. Choose based on cost, conductivity, environment.

Round PCBs optimize space in compact devices like wearables but face unique design challenges. Learn key considerations for effective implementation.

Zero PCB vs. Vero Board: Key differences, ideal uses, and step-by-step soldering tips for efficient DIY electronics prototyping.

Wire bonding enables precise microchip connections using ultrasonic tech, outperforming soldering in heat-sensitive semiconductor production with unmatched reliability.