Article & Blog

Explore thick, medium & thin electroless copper vs. direct plating for PCB holes. Balance cost, control & complexity. Most manufacturers recommend thin electroless copper for

Fix PCB EMI with 6 proven methods: strategic grounding, power routing, filtering, loop reduction, 45° traces, and shielding. Pass EMI certification.

Discover key double-sided FPC steps: cutting, drilling, hole metallization, cleaning & resist coating. Learn how precision ensures flexible circuit reliability.

Critical PCB layout practices for buck converters: minimize high-di/dt power loop area with short/thick traces, place input caps near Vin/PGND, reduce SW noise impact, and

Master BGA design: Avoid routing nightmares, thermal chaos & hidden defects with IPC standards, microvia strategies, thermal management, rework, and advanced QA.

Why choose costly ceramic PCBs over FR4? Essential for >150°C/high-frequency applications with unmatched thermal conductivity & signal integrity. Avoids system failures despite higher cost.

Choose the right PCB test method to prevent costly failures. Learn which test (ICT, Flying Probe, AOI) fits your volume, budget, and complexity. Avoid defects,

Avoid China PCB partner pitfalls: demand full cost transparency, validate Gerber files rigorously & cultivate multi-site resilience. Prioritize technical skill over lowest price.

Choose LGA over BGA for cheaper repairs, easier visual inspection & thermal efficiency. Ideal for desktops/servers needing upgrades without performance loss. Cut manufacturing costs &

Choose LGA over BGA for cheaper repairs, easier visual inspection & thermal efficiency. Ideal for desktops/servers needing upgrades without performance loss. Cut manufacturing costs &