How to Panelize Irregular Shapes?
Master IRREGULAR PCB panelization: cut 40%+ material waste with smart nesting & breakaway methods. Avoid clearance failures and hidden costs.
What Are Optocouplers and How Do They Work?
Optocouplers use light to isolate circuits, blocking noise and voltage spikes. Learn types: light paths (internal/external), outputs (diode to power), packages, digital/linear, and speed for fail-proof designs.
THT vs SMT: Which fits your project?
Choose PCB tech wisely: Through-Hole (THT) for robustness in high-power/vibration/repair-heavy applications. Surface Mount (SMT) excels in compact designs, volume production, and cost efficiency. Match needs to avoid failures.
What’s the Difference Between PCB Immersion Gold and Electroplated Gold?
Immersion gold offers thicker, uniform coating for superior soldering, signal integrity, and lifespan. Electroplated gold suits cost-sensitive, low-wear applications like gold fingers. Choose based on PCB needs to avoid failures.
What’s the Difference Between Packaging Substrates and PCBs?
Packaging substrates bridge chips to PCBs with ultra-high density for miniaturization; PCBs connect larger components in functional circuits. Key differences: density, manufacturing, and roles. Avoid costly mix-ups.
Which PCB Hole Metallization Process Is Right for You?
Explore thick, medium & thin electroless copper vs. direct plating for PCB holes. Balance cost, control & complexity. Most manufacturers recommend thin electroless copper for optimal reliability.
Is Your PCB Design EMI-Compliant?
Fix PCB EMI with 6 proven methods: strategic grounding, power routing, filtering, loop reduction, 45° traces, and shielding. Pass EMI certification.
What Are the Key Processes in Double-Sided FPC Manufacturing?
Discover key double-sided FPC steps: cutting, drilling, hole metallization, cleaning & resist coating. Learn how precision ensures flexible circuit reliability.
What should be paid attention to in PCB power supply layout?
Critical PCB layout practices for buck converters: minimize high-di/dt power loop area with short/thick traces, place input caps near Vin/PGND, reduce SW noise impact, and optimize copper/vias for thermal/EMI performance. Essential for stable power delivery.
How to Design the Perfect BGA?
Master BGA design: Avoid routing nightmares, thermal chaos & hidden defects with IPC standards, microvia strategies, thermal management, rework, and advanced QA.
