Avoid SMT prototype fails! Top defects (tombstoning, bridging, BGA issues) with fixes. Key: design audits, communication with assembly shops & pre-testing. Save costs & time.
Learn to test diodes with any multimeter: Set to diode/resistance mode, probe anode/cathode. Identify healthy (0.5-0.8V drop) vs faulty diodes (shorted/open/leaky). Prevent circuit failures with
Spot shiny, smooth solder joints; avoid dull, cracked ones. Use correct solder/flux for electronics or plumbing to prevent failures and save costs. Master inspection for
Master PCB via design: Choose blind/buried vias for dense layouts, calculate size/spacing to prevent overheating, and avoid common failure causes. Essential for modern circuit reliability.
Learn circuit schematic basics: wire connection rules (dots = connected), component symbols like Rs and Cs, and practical debugging steps using diagrams to avoid wiring
Master BGA packages: superior density & thermal performance need precision soldering, X-ray inspection, and BGA vs LGA comparison for optimal electronics assembly reliability.
HASL finish offers cost-effective copper protection against PCB oxidation but has critical flaws like uneven surfaces and thermal stress. Explore when to use HASL versus