Article & Blog

Master PCB layout to minimize switching power supply EMI. Key strategies: reduce high di/dt & dv/dt loop areas, implement loop cancellation, optimize grounding schemes, shield

Master PCB component packaging basics: types (DIP plug-in vs. SMD surface mount), common packages for diodes, capacitors, resistors, and ICs, essential elements (pads, outline, silkscreen),

Reflow soldering forms critical PCB connections. Learn how temperature control prevents defects like cold joints, component drift & board warping. Optimize profiles with thermal sensors!

PCB tooling holes are vital for mounting hardware, PCB stability, manufacturing alignment, and test fixtures. Design standards prevent failures; detail is critical for mfg success.

Master PCB stackup design: factors like cost, signal layers, EMI reduction & symmetry. Key principles for impedance control, power-ground coupling & layer arrangement in multilayer

PCB pad design standards prevent defects: min pad size 0.25mm, max 3x aperture, shapes like oval/rectangular. Avoids soldering failures, production delays, scrap costs. Optimizes reliability

Ensure etching quality in PCB manufacturing to prevent incomplete etching, side etching, etching interlayer, over-etching, and dry film bite. Optimize parameters, maintain equipment, and train

Cross-split in PCB design disrupts signal return paths, causing impedance issues, EMI, and crosstalk. Mitigate via stitching capacitors, cross-line bridging, and high-speed routing best practices.

cheaper production, full automation & tiny devices enabled. See how surface mount revolutionized manufacturing forever.

Identify PCB connector type & lock first! Use precise tools – solder tools for soldered joints, gentle leverage for mounted. Avoid force; patience prevents board