PCB prepreg’s Tg, Dk, and CTE impact thermal stability, signal integrity, and reliability. Wrong choice causes delamination, impedance mismatch, failures.
Tang, Ying
2025 年 4 月 30 日
PCB prepreg’s Tg, Dk, and CTE impact thermal stability, signal integrity, and reliability. Wrong choice causes delamination, impedance mismatch, failures.
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