Which IC packages dominate modern electronics?
Master IC package selection: BGA for high-speed/high-pin, QFP for cost efficiency. Unlock chiplet/3D performance gains and conquer signal/thermal challenges with proven PCB strategies.
What is BGA soldering?
Master BGA soldering: Prevent bridging/voids with precise temp control, baking & flux. Essential tools: stencils, reflow ovens, X-ray inspection ensure reliable high-density connections.
What is a blind via?
Blind vias save space in dense PCBs by connecting outer to inner layers selectively. Essential for HDI designs like smartphones, they optimize routing & thermal management, but increase cost 15-30%. Combines with microvias.
What are the most common PCBA testing methods?
PCBA testing (AOI, ICT, FCT) catches defects early, prevents recalls & saves costs. Choose methods by risk, budget & volume. Systematically debug failures to protect reputation & profits.
What are the signs an AC control board is failing?
Identify AC control board warning signs like random shutdowns, understand replacement costs ($150–$700), select exact replacements, and safely source boards from China suppliers.
Why Does PCBA Cost More Than PCB?
Understand why PCBA costs exceed PCB: component sourcing, precise assembly (SMT/THT), and rigorous testing (X-ray, functional checks) add labor, materials, and engineering expenses.
What Is a PCB Switch?
Solve faulty switches with the right PCB switch type: push-button, toggle, slide, or membrane. Learn selection criteria, design rules, and China sourcing tips for reliability.
What Is PCB Milling?
Instant PCB prototypes without outsourcing? DIY milling saves days but demands expertise. Master waste reduction, bit selection, and workflow to avoid costly errors & bottlenecks.
What Types of PCB Antennas Exist?
Fix weak PCB wireless signals: select antenna types (monopole/shark fin), calculate dimensions using wavelength formulas, optimize materials (Rogers/PTFE), and ensure mass-production resilience.
Why Is AOI Critical for SMT Assembly?
AOI is critical for SMT assembly, detecting placement/soldering defects early. Choose 2D vs 3D AOI based on component complexity. Combine with SPI/AXI & AI for full coverage & reduced false calls.
