What is the Method of IC Test?

IC testing ensures chip reliability through continuity, parametric, functional & burn-in checks. Avoid 78% failures via correct workflows and temperature stress testing methods.

Why Do SMD Components Fail?

This article systematically analyzes the three major causes of SMD component failure – ESD, mechanical/thermal stress, and latent soldering defects, revealing micron-level hidden dangers that are difficult to detect with conventional testing

Send Us a Message

The more detailed you fill out, the faster we can move to the next step.

Microchip Removal