What are the characteristics of SMT components?

CONTENTS

Make electronic products smaller and have higher assembly density

Compared with traditional plug-in component products, SMT patch components reduce the volume of electronic products by 40%-60%, and the volume is only about 10% of traditional packaged components; SMT patch components reduce the mass of electronic products by 60%-80%, and the weight is only 10% of traditional plug-in components. SMT components use through-hole mounting technology to increase assembly density.

Micro-Circuit Boards

High reliability and strong vibration resistance

SMT patch processing uses sheet components, which is one order of magnitude lower than the through-hole component wave soldering technology, and can effectively reduce the solder joint defect rate of electronic products or components.

Good high-frequency characteristics and good performance

SMT patch processing uses sheet components to make the mounting firm, usually leadless or short-lead components, which reduces the influence of parasitic inductance and parasitic capacitance, improves the high-frequency characteristics of the circuit, and reduces electromagnetic and radio frequency interference.

High-Speed ​​PCB Routing

High productivity, automated production

To achieve full automation of perforated printed circuit board installation, the original printed circuit board area needs to be expanded by 40% to ensure that the automatic plug-in head can insert the components, otherwise there will be insufficient clearance and damage to the parts. Small components and fine-pitch QFP devices are also produced by automatic placement machines, which truly realizes full-line automatic production.

Reduce production costs

  1. The use area of PCB boards is reduced to 1/12 of through-hole technology. If CSP is used, the installation area will be greatly reduced.
  2. Reduce the number of holes drilled on the PCB board and save rework costs.
  3. Improve frequency characteristics and reduce circuit debugging costs.
  4. Chip components are small in size and light in weight, which reduces packaging, transportation and storage costs.
  5. SMT placement technology can save materials, energy, equipment, manpower and time.
Share it :

Send Us A Message

The more detailed you fill out, the faster we can move to the next step.

Get in touch

Where Are We?

Factory Address

Industrial Park, No. 438, Shajing Donghuan Road, Bao'an District, Shenzhen, Guangdong, China

Head Office Address

Floor 4, Zhihui Creative Building, No.2005 Xihuan Road, Shajing, Baoan District, Shenzhen, China

HK Office Address

ROOM A1-13,FLOOR 3,YEE LIM INDUSTRIAL CENTRE 2-28 KWAI LOK STREET, KWAI CHUNG HK,CHINA

Let's Talk

Phone : +86 400 878 3488

Send Us A Message

The more detailed you fill out, the faster we can move to the next step.

Microchip Removal