SMT reflow PCB temperature curve explanation
Solder reflow requires precise thermal profiles (preheat, soak, reflow, cooling) with 2-5°C/s ramp rates, 215±5°C peak, and controlled cooling to ensure defect-free metallurgical bonding.
The Difference Between Immersion Gold and Gold Plating in PCB
ENIG vs gold plating: ENIG excels in complex/high-frequency PCBs, gold plating for durability. Choose based on cost, conductivity, environment.
