Master IC package selection: BGA for high-speed/high-pin, QFP for cost efficiency. Unlock chiplet/3D performance gains and conquer signal/thermal challenges with proven PCB strategies.
+86 4008783488
Industrial Park, No. 438, Shajing Donghuan Road, Bao'an District, Shenzhen, Guangdong, China
Floor 4, Zhihui Creative Building, No.2005 Xihuan Road, Shajing, Baoan District, Shenzhen, China
ROOM A1-13,FLOOR 3,YEE LIM INDUSTRIAL CENTRE 2-28 KWAI LOK STREET, KWAI CHUNG HK,CHINA
Phone : +86 400 878 3488
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