How to standardize the design of ceramic PCB substrates?
Design specs for Al₂O₃, AlN, Si₃N₄ ceramic substrates. Covers HTCC/LTCC/DPC processes, electrical/thermal/mechanical design, reliability requirements, and material selection for power/RF/LED applications.
The Most Comprehensive SMT Reflow Process Analysis Ever
Comprehensive guide to 9 reflow soldering types: hot plate, IR, IR+hot air, nitrogen, double-sided, through-hole, lead-free, flex board & vertical vacuum ovens. Compares mechanisms, benefits & SMT applications.
