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Manufacturing Process Capability

PCB Fabrication & Turnkey PCBA Production Standards

High-Mix Production

Prototype to mass production with stable process control.

Certified System

ISO-based quality management with controlled documentation.

Full Traceability

Lot control, inspection records and full production tracking.

PCB Fabrication Capability

Manufacturing capabilities across rigid, flexible and hybrid PCB technologies.

Rigid PCB

  • 1–64 Layers
  • FR-4 / High-TG / Rogers
  • Min Trace/Space: 3/3 mil
  • Thickness: 0.2–6.0 mm

Flex PCB

  • 1–8 Layers
  • Polyimide Material
  • Dynamic & Static Flex
  • Thickness: 0.1–0.6 mm

Rigid-Flex PCB

  • 1–20 Layers
  • Hybrid Construction
  • Controlled Impedance
  • High Reliability Design

PCBA Assembly Capability

SMT, THT and testing capabilities for reliable turnkey PCBA production.

SMT Assembly

  • Package: 0201 / QFN / BGA
  • Placement Accuracy: ±0.03 mm
  • Stencil / Reflow / Profiling
  • SPI + AOI in-line inspection

THT & Mixed Tech

  • DIP / Hand Solder / Selective Solder
  • Through-hole connectors & power parts
  • SMT + THT mixed assembly support
  • Rework & repair capability

Testing & Quality

  • AOI: 100%
  • X-Ray for BGA / QFN (as required)
  • Functional Test / Aging (upon request)
  • Full traceability & QC records

Process Flow Overview

Standard production flow for PCB fabrication and turnkey PCBA assembly.

PCB Fabrication

  1. DFM Review & Engineering
  2. Material Preparation
  3. Inner Layer Imaging / Etching
  4. Lamination
  5. Drilling
  6. Plating
  7. Outer Layer Imaging / Etching
  8. Solder Mask
  9. Surface Finish
  10. Silkscreen
  11. Electrical Test
  12. Final Inspection & Packing

Turnkey PCBA

  1. BOM Check & Sourcing
  2. IQC Incoming Inspection
  3. Stencil & Solder Paste Printing
  4. Pick & Place
  5. Reflow Soldering
  6. SPI / AOI Inspection
  7. THT / Hand Solder (if needed)
  8. X-Ray (BGA/QFN, if needed)
  9. Functional Test (upon request)
  10. Final QC & Packaging
  11. Shipment
Note: Steps may vary by product technology (HDI, impedance control, rigid-flex, etc.). Full traceability records available upon request.

Engineering Support & DFM Control

Pre-production review and process control to ensure manufacturability and stable mass production.

DFM Review

  • Gerber / PCB stack-up validation
  • Impedance & layer structure check
  • Minimum trace/space verification
  • Risk point feedback before production

BOM & Sourcing Control

  • Approved supplier channel sourcing
  • Alternative part confirmation
  • Lot / Date code traceability
  • IQC inspection records

Production Monitoring

  • Process parameter control
  • In-line inspection checkpoints
  • Engineering change control (ECO)
  • Quality report upon request

Technical Specifications – PCB Fabrication

Detailed manufacturing parameters and material capability.

PCB Boards

Rigid PCB Process Capability

Flex PCB

Flex PCB Process Capability

Rigid-Flex PCB

Rigid-Flex PCB Process Capability

Technical Specifications – PCBA Assembly

SMT accuracy, inspection standards and assembly limits.
PCB Assembly

PCB Assembly Process Capability

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