Let’s take a look at some information about the iPhone 17, iPhone 17 Pro, iPhone 17 Pro Max, and iPhone Air. The latest iPhone Air is claimed to be the thinnest iPhone yet. The iPhone 17 series all feature the new A19 or A19 Pro CPU chips, upgraded iPhone main cameras, OLED screens, and excellent iPhone battery life.
The iPhone 17 Pro shares the same layout as other phones with aluminum unibody bodies (like the GG Pixel 1 and 2). The midframe is removable and screws securely to the unibody. The 17 Pro’s vapor chamber is integrated into the midframe, while the battery is fixed to the bottom.
Replacing the battery is even easier this year. The battery is now glued to the midframe and can be removed by unscrewing it. The vapor chamber is located on the midframe and connects the motherboard to the rest of the phone.
We can now see a diagram of the iPhone 17 series’ motherboard. The iPhone 17 series motherboard still uses a double-layer structure, which means that when repairing the iPhone 17 and iPhone 17 Pro series, tools such as the iPhone motherboard test fixture and the iPhone motherboard mid-layer soldering platform are still required.
iPhone 17 motherboard assembly (RF board IC assembly): The RF board includes the iPhone battery connector, charging port connector (tail connector), SIM card connector, other FPC connectors, iPhone baseband CPU, baseband EEPROM chip, power amplifier power management, infrared camera dot matrix projector floodlight, front camera power supply, etc.
