Article & Blog

PCB etching defects like undercutting, interlayer shorts, over-etching, and resist erosion critically impact yield & reliability. Strict control & maintenance are vital.

Master PCB design by optimizing material standards, high Tg for thermal endurance, and high-frequency specs like Dk/Df. Prevent signal loss, warping, and failures in reliable

HDI PCBs pack micro-vias ≤150μm and conductor spacing ≤100μm for ultra-high density. They outperform standard PCBs in wiring density, thermal dissipation, and signal integrity across

Learn 8 practical PCB pad repair techniques like copper foil, epoxy fills & trace jumpers. Save damaged boards from scrap with Jiepei’s professional rework methods.

Prevent PCB shorts & opens: ensure trace/via clearance, proper pad spacing, control impedance, minimize vias, optimize power/ground, prioritize testability & DFM standards.

FPC flexible circuits solve device miniaturization challenges. Learn key differences from rigid PCBs, material science, cost drivers, and how to choose manufacturers.

Choose DLP for precision, LPI for cost-effective clarity, or screen printing for simple boards. Your design complexity dictates the best silkscreen method to prevent assembly

Discover key PCB assembly standards (ISO, IPC), realistic cost breakdowns, and timelines. Master manufacturing to avoid defects, budget surprises, and shipping delays for reliable electronics.

Get PCBs in 48 hours for emergencies but costs 2-3x more & has risks. Learn cost drivers, hidden pitfalls, and complexity limits.

Master PCB laminate properties, defects, and material differences (prepreg vs core). Prevent high-speed signal issues, delamination, and costly failures. Essential for reliable circuit boards.