Article & Blog

Learn PCB stackup design principles (adjacent ground layers, symmetry) for optimal impedance matching in high-speed circuits. Includes RK3588 8-layer through-hole case study with trace width

Learn 11 causes of uneven PCB color like squeegee blade issues, improper ink viscosity, screen gap problems & printing speed. Discover fixes for consistent PCB

Design specs for Al₂O₃, AlN, Si₃N₄ ceramic substrates. Covers HTCC/LTCC/DPC processes, electrical/thermal/mechanical design, reliability requirements, and material selection for power/RF/LED applications.

Comprehensive guide to 9 reflow soldering types: hot plate, IR, IR+hot air, nitrogen, double-sided, through-hole, lead-free, flex board & vertical vacuum ovens. Compares mechanisms, benefits

Gerber files are standardized PCB design formats critical for manufacturing. They define layers, dimensions, and components to prevent errors, reduce costs, and ensure efficient production.

PCB etching defects like undercutting, interlayer shorts, over-etching, and resist erosion critically impact yield & reliability. Strict control & maintenance are vital.

Master PCB design by optimizing material standards, high Tg for thermal endurance, and high-frequency specs like Dk/Df. Prevent signal loss, warping, and failures in reliable

HDI PCBs pack micro-vias ≤150μm and conductor spacing ≤100μm for ultra-high density. They outperform standard PCBs in wiring density, thermal dissipation, and signal integrity across

Learn 8 practical PCB pad repair techniques like copper foil, epoxy fills & trace jumpers. Save damaged boards from scrap with Jiepei’s professional rework methods.

Prevent PCB shorts & opens: ensure trace/via clearance, proper pad spacing, control impedance, minimize vias, optimize power/ground, prioritize testability & DFM standards.