Driven by AR/VR hardware iteration, high-end FPC & HDI PCB demand rises in 2026. Prismark forecasts global PCB market hitting $95.6B, with AR/VR segment maintaining strong double-digit growth in the coming years.
Avary Holding
- Location: Shenzhen, Guangdong Province, China
- Company type: Electronics and PCB manufacturing
- Year founded: 1999
- The number of employees: ~200
- Main product: FPC, SLP, rigid PCB, rigid-flex PCB, HDI
- Key Focus: FPC and SLP for flagship consumer electronics, AR/VR hardware
- Company's official website: https://www.avaryholding.com/en/
- Profile: It ranks No.1 globally by PCB revenue. It has massive automated factories and long-term partnerships with top consumer brands.
- Products and Business: Supplies FPC, SLP and other interconnect boards for AR/VR, mobile, wearable and automotive electronics.
Zhen Ding Technology
- Location: Taoyuan City, Taiwan, China
- Company type: Electronics and PCB manufacturing
- Year founded: 2006
- The number of employees: ~200
- Main product: FPC, SLP, rigid-flex PCB, HDI, IC substrates
- Key Focus: One-stop PCB solutions for mobile, wearable and AR/VR platforms
- Company's official website: https://www.zdtco.com/en/
- Profile: Listed on TWSE, global top PCB group. It owns Avary Holding and expands capacity in Thailand and India.
- Products and Business: Provides full-spectrum PCBs and IC substrates for consumer, communication, automotive and AR/VR devices.
AT&S
- Location: Leoben, Styria, Austria
- Company type: High-end electronics and PCB / IC substrate manufacturing
- Year founded: 1982
- The number of employees: ~200
- Main product: Any-layer HDI PCB, mSAP boards, ECP embedded component packaging, IC substrates
- Key Focus: High-end HDI and embedded packaging for smart glasses and immersive AR/VR devices
- Company's official website: https://ats.net/en/
- Profile: European leading high-end interconnect maker. It invests heavily in IC substrate and miniaturization technology.
- Products and Business: Develops advanced HDI, embedded packaging and IC substrates for AR/VR, automotive, aerospace and computing.
Unimicron Technology
- Location: Taoyuan City, Taiwan, China
- Company type: Electronics and PCB / IC carrier manufacturing
- Year founded: 1990
- The number of employees: ~300
- Main product: Microvia HDI, rigid-flex PCB, high-layer IC carrier substrates
- Key Focus: Compact interconnect boards for wearable and AR/VR display modules
- Company's official website: https://www.unimicron.com
- Profile: TWSE-listed advanced PCB and IC carrier manufacturer with global production bases across Asia.
- Products and Business: Produces HDI, rigid-flex and IC carriers for wearables, AR/VR, computing and automotive electronics.
South‑Electronic
- Location: Shenzhen, Guangdong Province, China
- Company type: Electronics and PCB & PCBA manufacturing service
- Year founded: 2010
- The number of employees: ~100
- Main product: Multilayer PCB, HDI, flex/rigid‑flex PCB, high‑frequency PCB, turn‑key PCBA assembly
- Key Focus: High‑mix low‑volume turnkey PCB‑PCBA solutions for hardware startups and small OEM manufacturers
- Company's official website: https://southelectronicpcb.com
- Profile: It holds ISO9001, ISO13485, IATF16949 certifications. It serves global clients, providing reliable prototype‑to‑medium‑batch electronic manufacturing services.
- Products and Business: Delivers PCB fabrication, component sourcing, SMT/THT assembly and box‑build integration for multiple industry verticals.
Mektec
- Location: Tsukuba City, Ibaraki Prefecture, Japan
- Company type: Electronics and flexible circuit manufacturing
- Year founded: 1969
- The number of employees: ~200
- Main product: FPC, FPCA flexible circuit assemblies, ultra-thin flexible components
- Key Focus: Precision FPC and flex assemblies for space-limited wearable and AR/VR hardware
- Company's official website: https://mektec.nokgrp.com/en/
- Profile: World-class FPC specialist under NOK Group. It operates factories in Asia, America and Europe.
- Products and Business: Manufactures ultra-thin FPC and assembled flex modules for AR/VR, mobile, automotive and wearable devices.
Compeq Manufacturing
- Location: Taoyuan City, Taiwan, China
- Company type: Electronics and PCB manufacturing
- Year founded: 1973
- The number of employees: ~200
- Main product: HDI PCB, multilayer rigid-flex PCB, FPC, SMT assembly
- Key Focus: High-density rigid-flex PCBs for compact handheld and AR/VR head-mounted devices
- Company's official website: https://www.compeq.com.tw
- Profile: One of Taiwan’s earliest PCB makers, TWSE listed, stable supplier for consumer and communication electronics.
- Products and Business: Produces HDI, rigid and rigid-flex PCBs for AR/VR headsets, mobile devices, servers and industrial equipment.
Shennan Circuits
- Location: Shenzhen, Guangdong Province, China
- Company type: Electronics, PCB and packaging substrate manufacturing
- Year founded: 1984
- The number of employees: ~200
- Main product: High-speed PCB, multilayer backplanes, IC packaging substrates, electronic assembly
- Key Focus: High-speed boards, substrates and module assembly for AR/VR and high-end electronics
- Company's official website: https://www.scc.com.cn/scc/en/gysn/index.html
- Profile: China’s leading PCB & substrate enterprise. It sets industry standards and serves global high-tech customers.
- Products and Business: Supplies high-speed PCBs, IC substrates and electronic assembly services for AR/VR, communication and computing hardware.
Kinsus Interconnect Technology
- Location: Taoyuan City, Taiwan, China
- Company type: Semiconductor and electronic interconnect manufacturing
- Year founded: 2000
- The number of employees: ~100
- Main product: High-end IC substrates, miniaturized interconnect carriers
- Key Focus: Miniaturized IC substrates for dense processor integration in AR/VR systems
- Company's official website: https://www.kinsus.com.tw
- Profile: TWSE-listed IC substrate specialist. It focuses on advanced packaging substrates for high-performance chips.
- Products and Business: Develops and manufactures high-density IC substrates for AR/VR processors, computing and semiconductor packaging.
JLCPCB
- Location: Shenzhen, Guangdong Province, China
- Company type: Electronics rapid prototyping & PCB manufacturing
- Year founded: 2006
- The number of employees: ~100
- Main product: Multilayer PCB, prototype PCB, PCBA assembly, small-batch circuit boards
- Key Focus: Fast prototype and small-batch PCB validation for AR/VR startups and R&D
- Company's official website: https://jlcpcb.com
- Profile: Global well-known rapid PCB prototyping platform, serving millions of hardware developers worldwide.
- Products and Business: Offers fast-turn PCB prototypes, small-batch PCBs and PCBA for AR/VR R&D verification and wearable projects.
If you’re sourcing AR/VR PCBs for prototyping or mass production, South-Electronic supplies rigid-flex, FPC and HDI boards. Send your specs to inquiry@southelectronicpcb.com for a prompt quote.
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